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Cite this article as: Wang Ju-Ping,Kuang Chun-Chun,Liu Ni. Experimental study on pool boiling heat transfer performance based on etching treatment [J]. J. At. Mol. Phys.(原子与分子物理学报), 2025, 42: 036008 (in Chinese)
Experimental study on pool boiling heat transfer performance based on etching treatment
Hits 232  Download times 75  Received:August 27, 2023  Revised:September 12, 2023
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DOI   10.19855/j.1000-0364.2025.036008
Key Words   pool boiling  etching  heat transfer performance  bubble dynamics  micro- and nano-structured surfaces
Author NameAffiliationE-mail
Wang Ju-Ping* University of Shanghai for Science Technology wjp2018912@163.com 
Kuang Chun-Chun 上海理工大学  
Liu Ni 上海理工大学  
Abstract
    To investigate the improvement effect of etching-treated copper plate surface on the heat transfer performance of pool boiling, a visualization experimental platform was built to prepare surfaces treated with different etching concentrations and etching times, and saturated pool boiling experiments were conducted using deionized water as the working medium. The results showed that the greater the ammonia etching concentration, the stronger the heat transfer performance of the surface, and the longer the ammonia etching time, the stronger the heat transfer performance of the surface. The heat transfer coefficients were increased by 46%, 92%, 105%, 36%, 45%, and 78% for a heat flow density of 43.2 W/cm2, respectively. In addition, the surface was characterized and the results illustrated the excellent boiling performance. The etching treatment enhances the surface roughness, and effective area and thus promotes liquid replenishment, being able to achieve higher CHF at smaller superheat. The visualization results show that the etched surface has more nucleation sites, smaller bubble leaving diameter, and leaving frequency. These results show the potential for enhanced pool boiling heat exchange on the etched surface.

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