| Cite this article as: Wang Mei-Ting,Qi Ying-Xia,Tao Jie,Chen Xi,Yang Yu-Shui,Zhang Lei,Liu Ni,Yang Guo-Cheng. Molecular dynamics simulation of wetting behavior of water droplets hitting solid surfaces at the nanoscale [J]. J. At. Mol. Phys.(原子与分子物理学报), 2025, 42: 022005 (in Chinese) |
| Molecular dynamics simulation of wetting behavior of water droplets hitting solid surfaces at the nanoscale |
| Hits 164 Download times 276 Received:May 06, 2023 Revised:May 26, 2023 |
| View Full Text View/Add Comment Download reader |
| DOI
10.19855/j.1000-0364.2025.022005 |
| Key Words
wettability, contact angle, molecular dynamics simulation, nanodroplet |
|
|
| Abstract
|
| In this paper, molecular dynamics methods are used to study the wetting process of water droplets colliding with copper walls at the nanoscale, and the effects of water droplet temperature and solid-liquid action intensity on wetting behavior. The wetting behavior of the water droplet and the equilibrium contact angle were in the temperature range of 273 K-353 K and the solid-liquid action intensity was in the range of 1-3, the wetting behavior and equilibrium contact angle of the water droplet were in the temperature and solid-liquid action intensity. The results show that the droplets will produce significantly different wetting evolution characteristics on different wetting walls. The simulation results show that for hydrophilic materials, the equilibrium contact angle decreases correspondingly because the potential energy binding of water molecules near the wall increases with the increase of temperature. For hydrophobic materials, the equilibrium contact angle tends to increase with temperature because the potential energy between molecules increases with increasing temperature than the potential energy between solids and liquids. Therefore, for the hydrophilic properties of its material, its wetting behavior can be affected by changing the temperature, thereby improving the heat transfer, mass transfer and self-cleaning performance. |
|
|
|
|
|
|
