| Cite this article as: Ding Can,Tian Hao-Bo,Chen Chen. Molecular simulation of thermal aging of plasma-modified polyimide [J]. J. At. Mol. Phys.(原子与分子物理学报), 2025, 42: 013001 (in Chinese) |
| Molecular simulation of thermal aging of plasma-modified polyimide |
| Hits 86 Download times 23 Received:June 07, 2023 Revised:June 23, 2023 |
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| DOI
10.19855/j.1000-0364.2025.013001 |
| Key Words
reactive molecular dynamics polyimide thermal aging |
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| Abstract
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| The thermal aging process of polyimide is simulated by reactive molecular dynamics method to simulate the property changes of plasma-modified polyimide materials after thermal cracking. By studying the generation of gas during aging, it was found that as the temperature increases, the interaction forces between molecular chains weaken, resulting in a decrease in the denseness of the material, a decrease in the modulus of elasticity, and a decrease in the ability of the material to resist external stress. At the same time, the relative dielectric constant of the polyimide material increases due to the increase of temperature, and the insulation property of the material decreases and the breakdown strength is also weakened. |
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